Systems & Engineering Platforms We Use
Holosystems Design – Advanced CAD & Simulation Stack
At Holosystems Design, engineering rigor begins with the tools we operate.
Advanced architectures demand advanced computational environments. We do not rely on generic design software. We operate an integrated, high-performance EDA and simulation stack capable of supporting complex multi-layer PCBs, high-speed interconnect systems, heterogeneous chiplet platforms, and FPGA-based architectural prototyping.
Our design environment reflects our ambition: precision, simulation depth, and system-level validation.
PCB Design
Cadence Allegro PCB Designer
For advanced board architecture and high-density interconnect systems, we use Allegro PCB Designer from Cadence Design Systems.
Allegro enables:
- Multi-layer and HDI board design
- High-speed differential routing
- Constraint-driven layout control
- Advanced stack-up engineering
- Rigid-flex and complex mechanical integration
- Carrier boards for chiplet and accelerator systems
This platform supports the design of high-performance computing boards, accelerator substrates, and precision control electronics where signal integrity and power distribution cannot be approximated — they must be engineered.
Signal & Power Integrity Simulation
HyperLynx
Signal integrity is physics, not guesswork.
We use HyperLynx for detailed signal and power integrity analysis across high-speed digital systems.
HyperLynx enables:
- DDR, PCIe, and high-speed serial link validation
- Crosstalk analysis
- Impedance control modeling
- Power distribution network validation
- Eye diagram simulation
- Timing and jitter analysis
This ensures our high-bandwidth systems meet strict performance and stability requirements before fabrication.
Electromagnetic Simulation
Ansys HFSS
For full-wave 3D electromagnetic simulation, we use Ansys HFSS.
HFSS enables:
- High-frequency interconnect analysis
- Field distribution modeling
- RF and microwave structure validation
- High-speed package modeling
- EMI/EMC evaluation
- Advanced interposer and substrate modeling
When designing chiplet carriers, high-density connectors, or RF-sensitive systems, accurate field-level modeling is mandatory. HFSS provides that capability.
Thermal Simulation
iSpec
High-performance architectures demand thermal engineering from the earliest design stage.
We use iSpec for thermal analysis and heat flow validation across complex boards and enclosures.
iSpec enables:
- Heat dissipation modeling
- Power density mapping
- Thermal gradient simulation
- Enclosure airflow evaluation
- Reliability-oriented temperature forecasting
Thermal stability is directly tied to performance and long-term reliability. It is engineered, not assumed.
FPGA Architecture & Prototyping
AMD Vivado
For FPGA-based prototyping, architecture validation, and hardware/software co-design, we use AMD Vivado.
Vivado enables:
- Hardware description language (HDL) synthesis
- High-speed interface prototyping
- Accelerator architecture validation
- Embedded processor integration
- Real-time system prototyping
- Hardware/software co-development workflows
FPGA-based platforms allow us to validate architectural concepts before committing to silicon or large-scale manufacturing.
Engineering Philosophy
Our toolchain is not a collection of isolated software licenses.
It is an integrated engineering environment designed to support:
- Chiplet-based architectures
- High-performance accelerator systems
- Heterogeneous computing platforms
- Quantum-adjacent control electronics
- Advanced industrial embedded systems
At Holosystems Design, simulation precedes fabrication.
Validation precedes deployment.
Architecture precedes marketing.
Our systems reflect our commitment to engineering discipline and architectural depth.
